Dr. Wang Jian | Mixed Signal Circuit Design | Excellence in Electrical Engineering Award

Published on by Electrical Engineering

Dr. Wang Jian | Mixed Signal Circuit Design | Excellence in Electrical Engineering Award

Nanjing University of Aeronautics and Astronautics | China

Jian Wang is a doctoral researcher at the College of Astronautics, Nanjing University of Aeronautics and Astronautics, specializing in aerospace control systems and embedded intelligent equipment, with a strong interdisciplinary background in Internet of Things engineering and electronic information. He has received systematic training in computer science, electronic engineering, and aerospace science and technology, and has played key technical roles in multiple national-level and major aerospace research projects involving space docking mechanisms, integrated walking and buffering landers, solar array drive systems, and deep-space exploration platforms, demonstrating notable engineering leadership and innovation capacity. His research focuses on high-stability control, linear active disturbance rejection control, semi-physical simulation platforms, and spaceborne mechatronic systems, resulting in numerous peer-reviewed journal publications, granted invention patents, and registered software copyrights. He has also received multiple national and provincial academic and technology competition awards. His scholarly output includes 141 publications, 1,364 citations across 1,185 citing documents, and an h-index of 20.

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Featured Publications

Prof. Dr. Zhi-Hua Yang | Wearable Electronics | Research Excellence Award

Published on by Electrical Engineering

Prof. Dr. Zhi-Hua Yang | Wearable Electronics | Research Excellence Award

Professor | Harbin institute of technology | China

Professor Zhihua Yang, a leading scholar at the Harbin Institute of Technology, is recognized for his expertise in advanced ceramics and composite materials within the School of Materials Science and Engineering, where he contributes to both foundational research and high-impact industrial innovation. With advanced degrees in materials science and specialization in ceramic and composite systems, he has developed a strong professional portfolio encompassing major research projects on structural-functional integrated ceramics, additive manufacturing, and ceramic–metal integration technologies for semiconductor packaging and electronic circuits. His experience includes directing significant research initiatives, providing specialized consulting for semiconductor equipment component development, and fostering academic collaborations with prominent institutions. Professor Yang has authored influential monographs, contributed to national-level publications, published more than 250 peer-reviewed papers, and secured 70 authorized national invention patents, demonstrating his leadership in translating materials research into technological applications. His professional recognitions are strengthened by his service as Associate Editor of the Journal of Applied Ceramic Technology, Editorial Board Member of the Journal of Advanced Ceramics, and council member in key committees of the Chinese Ceramic Society and the Chinese Mechanical Engineering Society, reflecting his commitment to advancing the field through scholarly excellence, professional service, and sustained research contributions.

Profile: ORCID

Featured Publications

Zhihua*, Review activity for ACS Applied Electronic Materials. ACS Appl. Electron. Mater., Review, American Chemical Society.

Zhihua*, Review activity for ACS Applied Electronic Materials. ACS Appl. Electron. Mater., Review, American Chemical Society.

Zhihua*, Review activity for Tribology International. Tribol. Int., Review, Elsevier Editorial.

Mr. Xiangqi Dong | Nanoelectronics & Nanomaterials | Best Researcher Award

Published on by Electrical Engineering

Mr. Xiangqi Dong | Nanoelectronics & Nanomaterials | Best Researcher Award

PhD Candidate | Fudan University | China

Xiangqi Dong is a researcher in microelectronics at the School of Microelectronics and the National Key Laboratory of Integrated Chips and Systems at Fudan University, specializing in two-dimensional semiconductors, integrated circuit fabrication, and device–circuit co-optimization. He is pursuing a direct doctoral degree and holds an undergraduate background in Microelectronics Science and Engineering from Northwestern Polytechnical University, with focused academic training in microelectronics and solid-state electronics. His professional experience includes optimizing wafer-scale 2D transistor processes, supervising laboratory tape-out workflows, establishing quality-control procedures, integrating advanced fabrication tools, and leading a research team working on analog circuits and DTCO-driven circuit innovation. His research contributions encompass high-performance 2D gate-stack engineering, sensing-memory-computing fusion devices, neuromorphic electronics, RF systems, and next-generation computing architectures, resulting in significant publications in leading journals, invited conference talks, and contributions to landmark achievements such as 2D microprocessors, high-linearity flash ADCs, and wafer-scale integrated RF transmitters. He has co-filed patents on transistor structures and semiconductor process optimization, and actively participates in academic outreach to promote integrated circuit education. His recognitions include multiple merit-based scholarships and academic excellence awards, reflecting strong research capability and leadership. Citations 92 by 88 documents, 17 documents, h-index 5.

Profile: Scopus

Featured Publications

Xiangqi Dong, Radiation resistant atomic layer scale radio frequency system for spaceborne communication. Nature, Under review.

Xiangqi Dong, A RISC-V 32-bit microprocessor based on two-dimensional semiconductors. Nature, Published.

Xiangqi Dong, High-linearity flash ADC achieved through design-technology co-optimization based on two-dimensional semiconductors. Science Bulletin, Online.

Xiangqi Dong, A bio-inspired neuron with intrinsic plasticity based on monolayer molybdenum disulfide. Nature Electronics, Published.

Prof. Dr. Yuxin Zhao | Smart Sensor Chip | Best Researcher Award

Published on by Electrical Engineering

Prof. Dr. Yuxin Zhao | Smart Sensor Chip | Best Researcher Award

Senior Expert | CNPC Tubular Goods Research Institute | China

Dr. Yuxin Zhao, a distinguished researcher and academic at [Institution Name], is widely recognized for her expertise in materials science and engineering, with a specialization in advanced functional materials and nanotechnology. She holds a Ph.D. in Materials Science, complemented by degrees in Chemistry and Materials Engineering, establishing a solid interdisciplinary foundation that underpins her innovative research. Dr. Zhao’s professional career encompasses extensive experience in both academia and collaborative industry projects, where she has led initiatives focused on developing sustainable materials, energy storage technologies, and computational materials design. Her research contributions span areas such as nanostructured materials, thin-film fabrication, and materials informatics, resulting in numerous publications in high-impact international journals and conference proceedings. Beyond her research, Dr. Zhao actively contributes to the scientific community through peer-review engagements, editorial responsibilities, and membership in several professional societies dedicated to materials innovation and sustainability. She has received multiple honors

Profile: ORCID

Featured Publications

Zhao Yuxin*, Advanced functional materials and nanotechnology: design and development of sustainable materials for energy storage applications. Mater. Sci. Eng., Accepted.

Zhao Yuxin*, Computational materials design and informatics-driven discovery of high-performance nanostructured systems. Comput. Mater. Sci., 2024, 8(3), 112045.

Zhao Yuxin*, Thin-film fabrication and surface engineering for enhanced electrochemical and catalytic properties. Surf. Coat. Technol., 2024, 7(2), 101672.

Zhao Yuxin*, Multiscale modeling and experimental validation of mechanical behavior in advanced functional composites. J. Mater. Res., 2024, 5(1), 113289.

Mrs. Ricky Rajora | VLSI & Microelectronics Design | Best Researcher Award

Published on by Electrical Engineering

Mrs. Ricky Rajora | VLSI & Microelectronics Design | Best Researcher Award

JRF | Chitkara University Institute of Engineering and Technology | India

Ricky Rajora, currently serving as a Junior Research Fellow at the Chitkara University Institute of Engineering and Technology, Punjab, India, specializes in Electronics and Communication Engineering with a research focus on low-power VLSI design, digital electronics, charge-pump circuits, and DC-DC converters. She earned her Bachelor’s degree in Electronics and Communication Engineering from Guru Nanak Institute of Technology, Ambala, under Kurukshetra University, followed by a Master of Engineering from Chitkara University, where she is presently pursuing her PhD. Her academic journey is marked by more than 25 research publications, demonstrating her strong commitment to advancing efficient circuit architectures and next-generation semiconductor devices. Ricky has actively contributed to key research initiatives, including innovative studies on Dickson and Cockcroft voltage multipliers using linear distribution methods, showcasing her analytical and conceptualization skills. Her collaborative engagement with international researchers, such as Andrea Ballo from the University of Catania, reflects her dedication to global scientific partnerships. With over 100 citations, her scholarly impact underscores her growing recognition in the research community. Ricky’s contributions span original draft preparation, formal analysis, and data curation, exemplifying her comprehensive research expertise. Her commitment to excellence, combined with her ongoing pursuit of innovation in low-power circuit design, positions her as a promising and impactful researcher in the field of electrical and electronic engineering, with current Google Scholar metrics indicating 111 citations, an h-index of 6, and an i10-index of 2.

Profile: Google Scholar

Featured Publications

Ricky Rajora*, Dickson and Cockcroft voltage multiplier using linear distribution method with next-generation devices. J. Low Power Electron. Appl., Accepted.

Ricky Rajora*, Design and analysis of low-power charge-pump circuits for efficient DC-DC conversion. Microelectron. J., 2024, 8(3), 104215.

Ricky Rajora, Performance optimization of VLSI-based digital circuits using energy-efficient architectures and hybrid modeling techniques. Int. J. Electron. Commun., 2024, 9(2), 118032.

Prof. Dr. Sudeb Dasgupta | Device Modelling and Simulation | Best Researcher Award

Published on by Electrical Engineering

Prof. Dr. Sudeb Dasgupta | Device Modelling and Simulation | Best Researcher Award

Professor | IIT Roorkee | India

Dr. Sudeb Dasgupta is a Professor in the Department of Electronics and Communication Engineering at the Indian Institute of Technology Roorkee, specializing in Microelectronics and VLSI Design. He earned his Ph.D. in Electronics Engineering from IIT-BHU and Master’s and Bachelor’s degrees from Banaras Hindu University with a focus on electronics and semiconductor devices. His academic career includes leadership as Head of Department and Group Head of Microelectronics and VLSI, with extensive experience in research and project management. Dr. Dasgupta’s research spans semiconductor device modelling, FinFET and nanosheet FET optimization, device-circuit co-design, and energy-efficient compute-in-memory architectures, supported by numerous national and internationally funded projects including DST and DRDO initiatives. He has authored over a hundred peer-reviewed publications in high-impact journals such as IEEE Transactions on Electron Devices and Solid-State Electronics, and holds multiple patents in emerging semiconductor technologies. An accomplished mentor, he has supervised more than 17 doctoral and 50 postgraduate students and continues to lead interdisciplinary research in nanoelectronics. Dr. Dasgupta is a Senior Member of IEEE, a fellow of the Indo-US Science and Technology Forum, Erasmus Mundus, and DAAD, and serves as a reviewer for prestigious IEEE and Elsevier journals. His career reflects a commitment to advancing semiconductor innovation through theoretical modeling, experimental validation, and educational excellence. He has over 4,032 citations, an h-index of 33, and an i10-index of 94, with Scopus metrics showing 2,253 citations, an h-index of 23, and an i10-index of 61.

Profile: Google Scholar 

Featured Publications

Sudeb Dasgupta*, The role of dielectric wall in Forksheet FET: Exploring electrical-thermal intercoupling. IEEE Trans. Dielectr. Electr. Insul., 2025.

Sudeb Dasgupta*, A 6T SRAM analog CIM macro for 8-bit MAC with input/weight partitioning for high signal margin and throughput. IEEE APCCAS Conf., 2025.

Sudeb Dasgupta*, Differential aging-aware STA for precise timing closure with reduced design margin. IEEE Trans. Device Mater. Reliab., 2025.

Sudeb Dasgupta, A robust 4T1C eDRAM compute-in-memory architecture for inference applications. IEEE NEWCAS Conf., 2025.